Micro Assembly For MEMS Industry
Semiconductor Front End Process
Aerospace Aviation Industry
Intelligent and 4.0 Industry manufacturing
New energy Industry manufacturing
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Curing for PI/BCB |
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Temp.: ≤250℃ or 350℃ Oxygen Concentration：1~9999PPM Cleanliness: Class 100（FS209E） Filter: 99.99% @0.3μm High Temp. HEAP Filter Temperature uniformity: ≤ ±2.5% |
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Applicable Model: Class 100 O2 Monitoring Oven -COH Series
Cleaning O2 Monitoring Oven -DF Series
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Anti-Oxidation Storage |
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Oxygen Concentration：≈1% or ≤1000PPM Cleanliness: Class 10~1000 (FS209E) Antistatic：Antistatic materials for body and shelves with 106~109Ω |
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Applicable Model: Cleaning Nitrogen Cabinet -CNDH Series |
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