Micro Assembly For MEMS Industry
Semiconductor Front End Process
Aerospace Aviation Industry
Intelligent and 4.0 Industry manufacturing
New energy Industry manufacturing
Moisture Sensitive Devices (MSD) have become widely used with the increased sophistication of electronic products. However, MSDs present a number of challenges when used in surface mount assembly as they may suffer internal damage during the manufacturing process if they are not handled and stored according to industry standards.
|
|
|||||
|
|
|||||
|
MSD & PCB Storage |
|
||||
|
Humidity：≤5%RH（或≤10%RH） Recovery Time：≤15分钟 Antistatic：Antistatic materials for body and shelves with 106~109Ω |
|||||
|
Applicable Model: |
|||||
|
|
|||||
|
|
|
|
|
|
|
|
MSD & PCB Baking |
|
||||
|
Humidity：≤5%RH Temp.：40~125℃ Tem. Uniformity：≤±2.5% Recovery Time：≤15 mins |
|||||
|
Applicable Model: |
|||||
|
|
|
|
|
|
|